SEM has a large depth of field, high resolution, and a magnification of hundreds of thousands of times or more, which can be used to observe the surface and profile microstructure of samples; Equipped with EDS, it can simultaneously perform micro area material analysis on the surface of the sample, including qualitative and semi quantitative component analysis, as well as point, line scan, and mapping analysis for specific areas.

2D X-ray detection is currently an effective and fast method for analyzing internal defects in non-destructive testing products. X-ray can detect the internal structure of the tested object and whether there are defects, voids, cracks, and other abnormalities.

Ion beam profile grinding, Cross Section Polisher (referred to as CP), it uses ion beam cutting to cut the profile of a sample. Unlike general sample profile grinding, ion beam cutting can avoid stress effects caused by the grinding process.

Using optical lenses for magnification, reduction, and CCD to capture images and observe surface morphology.

SAT ultrasound can be used to detect delamination, cracks, air holes, and adhesion at different positions inside chip components, and is often used to inspect defects inside chip seals.

One of the fast sample preparation methods is to use sandpaper or diamond sandpaper, combined with subsequent polishing, to produce a clear sample surface.

By utilizing the permeability of liquids, it can penetrate all solder gaps to determine the integrity of the welding process.

It is necessary to analyze the internal chips, wiring, and components during chip failure analysis. Due to the obstruction of the packaging colloid, two combinations of "laser etching" and "wet etching" are used to expose the objects inside the packaging for subsequent experimental processing and observation.